| PART |
Description |
Maker |
| 2009G13 |
22 mm Aluminum Enclosure Gravity Die Cast 2005G13 and 2009G13
|
Altech corporation
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 3606 3601 |
Die Cast Aluminum Box Painted, Size “D
Die Cast Aluminum Box Painted, Size 隆掳D隆卤
|
Pomona Electronics
|
| AGD-315D-V2B-1010 |
IP65 Aluminum Die Cast Front Bezel
|
AAEON Technology
|
| 0936040172 |
GWconnect Enclosure, Die-cast Aluminum, S-8100 Series, without External Mounting Flanges
|
Molex Electronics Ltd.
|
| 0936040176 |
GWconnect Enclosure, Die-cast Aluminum, S-8100 Series, without External Mounting Flanges
|
Molex Electronics Ltd.
|
| 02-0104-0400 02-0140-0200 |
CAS-2000 Comprehensive Application System
|
JDS Uniphase Corporation
|
| CAS16D14 |
Transponder RX antenna< SMD Type: CAS Series>
|
SUMIDA[Sumida Corporation]
|
| KM44C4005C |
4M x 4Bit CMOS Quad CAS DRAM with Extended Data Out
|
Samsung semiconductor
|
| AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement)
8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices
SPANSION[SPANSION]
|
| KMM5361205C2W |
1MBx36 DRAM Simm Using 1MBx16 And 4MB Quad Cas Edo
|
Samsung Semiconductor
|
| MT4C4004 |
1 MEG x 4 DRAM QUAD CAS PARITY, FAST PAGE MODE
|
MICRON[Micron Technology]
|
