| PART |
Description |
Maker |
| NP276-16951 NP276-25626 NP276-11904-3 NP276-59608 |
Ball Grid Array (BGA, 1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| CSPESD304 |
4-Channel ESD Array in CSP
|
California Micro Devices
|
| AS4C64M16D3A-12BAN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| ECG2331 ECG2326 ECG2322 ECG2328 ECG2332 ECG2333 |
FAN AC 176X89 220V BALL, 420cfm
TRANSISTOR | BJT | DARLINGTON | NPN | 100V V(BR)CEO | 8A I(C) | TO-220VAR
FAN AC 172X51 115V BALL, 106cfm
TRANSISTOR | BJT | NPN | 200V V(BR)CEO | 15A I(C) | TO-247VAR 晶体管|晶体管| npn型| 200伏五（巴西）总裁|5A一（c）|47VAR
FAN AC 180X65 115V BALL, 400cfm 晶体管|晶体管|达林顿|叩| 60V的五（巴西）总裁|甲一（c）|20
FAN AC 180X65 115V BALL, 340cfm 晶体管|晶体管|叩| 450V五（巴西）总裁| 8A条一c）| TO - 220AB现有
|
Vishay Intertechnology, Inc.
NEC, Corp.
|
| M6MGD13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
