| PART |
Description |
Maker |
| CXK77P36E160GB-43BE CXK77P18E160GB-4BE CXK77P18E16 |
1M X 18 STANDARD SRAM, 3.7 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 4.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 3.8 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 4.1 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
16Mb LW R-L HSTL High Speed Synchronous SRAMs (512K x 36 or 1M x 18) 16Mb的龙运RL HSTL高速同步静态存储器（为512k × 3600万18
CAP 820PF 50V 20% X7R SMD-0603 TR-7 PLATED-NI/SN
|
http://
Yuasa Battery, Inc.
Integrated Circuit Technology Corp
Microsemi, Corp.
Sony, Corp.
Sony Corporation
|
| VSC8239 |
9.953 Gbps to 11.3 Gbps Dual XFP Signal Conditioner
|
Vitesse Semiconductor Corporation
|
| IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
| ATS-X50300P-C1-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-55270W-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-54230W-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-54170R-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-53330R-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-53230K-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
| ATS-55450D-C2-R0 |
High Performance BGA Cooling
|
Advanced Thermal Solutions, Inc.
|
