| PART |
Description |
Maker |
| MG1041 MG1041-11 MG1042-11 MG1043-11 MG1044-11 MG1 |
23 GHz - 25 GHz, GALLIUM ARSENIDE, PULSED GUNN DIODE
GUNN Diodes Anode Heat Sink
|
MICROSEMI CORP-LOWELL
Microsemi Corporation
|
| SDT04S60 SDD04S60 SDP04S60 Q67040-S4368 Q67040-S43 |
Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Body Material:Plastic; Color:Black; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sink Material:Plastic RoHS Compliant: No
Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Length:18.03mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Silicon Carbide Schottky Diodes - 4A diode in TO220-3 package
Silicon Carbide Schottky Diodes - 4A diode in TO252 package
Silicon Carbide Schottky Diodes - 4A diode in TO220-2 package
|
INFINEON[Infineon Technologies AG]
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| VHS-45 |
Extruded Heat Sink
|
CUI INC,
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| ATS-312-EXL-R0 |
HEAT SINK THERMAL RESISTANCE
|
Advanced Thermal Solutions, Inc.
|
| LPD45-25B LPD45-30B LPD45-10B LPD45-9B LPD45-6B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD35-20B LPD35-35B LPD35-5B LPD35-10B LPD35-3B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| ATS-56003-C1-R0 |
maxiFLOW Heat Sink, T412, BLACK-ANODIZED
|
Advanced Thermal Solutions, Inc.
|
