| PART |
Description |
Maker |
| BGA310 |
Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 9 dB typical gain at 1.0 GHz 9 dBm typical P-1dB at 1.0 GHz 3 dB-bandwidth: DC to 2.4 GHz)
|
Siemens Semiconductor Group
|
| Q62702-G0042 BGA312 |
Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 11 dB typical gain at 1.0 GHz 9 dBm typical P-1dB at 1.0 GHz)
From old datasheet system
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
|
| SST12LF09-Q3CE |
2.4 GHz High-Gain, High-Efficiency Front-end Module
|
Microchip Technology
|
| RFMA1720-0.5W-Q7 |
17.7 - 19.7 GHz High Gain Surface-Mounted PA
|
Excelics Semiconductor, Inc.
|
| RFMA7090-0.5W-Q7 |
7.0 - 9.0 GHz High Gain Surface-Mounted PA
|
Excelics Semiconductor, Inc.
|
| RFMA5065-0.5W-Q7 |
5.0 - 6.5 GHz High Gain Surface-Mounted PA
|
Excelics Semiconductor, Inc.
|
| RFMA1214-1W-Q7 |
12.50 - 14.50 GHz High-Gain Surface Mounted PA
|
Excelics Semiconductor, Inc.
|
| BNT01 |
1.5 -3.0 GHz Wideband High Linearity LNA Gain Block
|
BeRex Corporation
|
| PTH32003 |
25 Watts/ 1.9-2.0 GHz 50-Ohm High-Gain Power Hybrid
25 Watts, 1.9-2.0 GHz 50-Ohm High-Gain Power Hybrid
25 Watts, 1.9.0 GHz 50-Ohm High-Gain Power Hybrid
|
ERICSSON[Ericsson]
Ericsson Microelectronics
|
| LD7267 |
30 GHz / 100 W CW / CONDUCTION COOLING / HIGH POWER GAIN
30 GHz, 100 W CW, CONDUCTION COOLING, HIGH POWER GAIN
|
NEC
|
| LD7262 |
6 GHz / 750 W CW / CONDUCTION COOLING / HIGH POWER GAIN
6 GHz, 750 W CW, CONDUCTION COOLING, HIGH POWER GAIN
|
NEC Corp.
NEC[NEC]
|
