| PART |
Description |
Maker |
| KTD2017 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC849 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| PC-815 |
High Sensitivity, High Density Mounting Type Photocoupler
|
N/A
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
| IS354 |
HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
|
| LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司
Lite-On Technology Corporation
|
