| PART |
Description |
Maker |
| FCSP1H40TR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes
|
| SDM02U30CSP SDM02U30CSP-7 |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| FCSP05H40TR FCSP05H40TR11 |
FlipKY, Chip Scale Package Schottky Barrier Rectifier, 0.5 A
|
Vishay Siliconix
|
| FCSP1H40LTR FCSP1H40LTR11 |
FlipKY,1 A Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| ADG784 ADG784BCP |
ADMC200 & ADMC201 Motion Coprocessors
CMOS 3 V/5 V Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
CMOS 3 V/5 V/ Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package
|
AD[Analog Devices]
|
| ADF4602BCPZ-RL |
Single-Chip, Multiband 3G Femtocell Transceiver; Package: LFCSP: Leadform Chip Scale; No of Pins: 40; Temperature Range: Ind TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC40
|
Analog Devices, Inc.
|
| CSPESD303 CSPESD302 CSPESD301 |
"1, 2 and 3-channel ESD Arrays in Chip Scale Package "
|
California Micro Devices
|
| NP383-28804-N NP383-28804-P NP383-84107-N NP383-84 |
Chip Scale Package -TH (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| CM1205-08CP |
8-Channel ESD Protection Array in Chip Scale Package
|
ON Semiconductor
|
| 28F3204C3 |
3 V Advanced Stacked Chip Scale Package Memory(3V高级堆芯片封装存储器) 3伏高级堆叠芯片级封装存储器（3V的高级堆芯片封装存储器）
|
Intel, Corp.
|
