| PART |
Description |
Maker |
| BIR-BO07J4G |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
| BIR-BM1731 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| BIR-BN0331 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
| BIR-BM13E4G-2 |
17 Bit System Integrating A/D Processor, 16L PDIP
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| AD73311ARS AD73311ARZ AD73311LARUZ-RL7 |
Low Cost/ Low Power CMOS General Purpose Analog Front End
Single-Channel, 3 V and 5 V Front-End Processor for General Purpose Applications Including Speech and Telephony; Package: SOIC - Wide; No of Pins: 20; Temperature Range: Industrial SPECIALTY TELECOM CIRCUIT, PDSO20
Low Cost, Low Power CMOS General Purpose Analog Front End
|
Analog Devices, Inc.
|
| SON MICROLEADFRAME DFN |
Saw MLF PEL (Plated End Lead) Package
|
Amkor Technology
|
| 2SB815 |
Ultrasmall package allows miniaturization in end products. low-saturation voltage.
|
TY Semiconductor Co., Ltd
|
| FCW302 |
Package: 3.5*2.8*0.85 mm Applications: Mobile Handset Flash Light
|
Seoul Semiconductor
|
| OP280 |
Infrared Light Emitting Diode in SMT Plastic Package
|
OPTEK Technologies
|
| OP270 OP272 |
Infrared Light Emitting Diode in SMD Plastic Package
|
Optek Technology
OPTEK Technologies
|
| MR301 MR301-24 MR301-24H MR301-24HL MR301-24HS MR3 |
The MR301 series, which has a low profile package and light weight,
|
NEC
|
