| PART |
Description |
Maker |
| V826532K04S |
2.5 VOLT 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE
|
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| V827432K24S |
2.5 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC DDR SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp]
|
| V436632Z24V V436632Z24VXTG-75PC V436632Z24VXTG-10P |
IC ARM920T MCU 200MHZ 352-PBGA
3.3 VOLT 32M x 64 HIGH PERFORMANCE 133 MHZ SDRAM UNBUFFERED SODIMM
|
Mosel Vitelic, Corp.
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
Mosel Vitelic Corp
|
| V54C3256164VS V54C3256164VT V54C3256404VS V54C3256 |
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4
3.3V, 2K refresh ultra-high performance 1M x 16 SDRAM 2 banks x 512Kbit x 16
|
Mosel Vitelic Corp
|
| IBM13M32734BCD |
32M x 72 2-Bank Registered/Buffered SDRAM Module(32M x 72 2组寄缓冲同步动态RAM模块) 32M × 72配置2，银行注缓冲内存模组2M × 72配置2组寄缓冲同步动态内存模块）
|
IBM Microeletronics
International Business Machines, Corp.
|
| KMM372V3200BS1 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| V54C3128804VS V54C3128404VS V54C3128804VT |
128Mbit SDRAM 3.3 VOLT/ TSOP II / SOC PACKAGE 8M X 16/ 16M X 8/ 32M X 4
128Mbit SDRAM 3.3 VOLT, TSOP II / SOC PACKAGE 8M X 16, 16M X 8, 32M X 4 128Mbit SDRAM.3伏，第二的TSOP / SOC的包米1616米x 82 × 4
|
Mosel Vitelic Corp
Mosel Vitelic, Corp.
|
| AT45DB321D-TU AT45DB321D-CNU AT45DB321D-MU AT45DB3 |
32-megabit 2.7-volt DataFlash 32M X 1 FLASH 2.7V PROM, DSO8
|
Atmel Corp.
Atmel, Corp.
|
| AT45DB321D-MU-SL955 AT45DB321D-MWU-SL955 AT45DB321 |
32-megabit 2.7-volt DataFlash
32M X 1 FLASH 2.7V PROM, PDSO8
|
ATMEL Corporation
|
| AT49SN6416 |
64M bit and 32M, 1.8-Volt Burst and Page Mode Flash Memory
|
Atmel Corp
|
| AT80C51RD2-SLRUM AT80C51RD2-RLRUM |
IC MCU 80C51 HI PERFORM 44PLCC 8-BIT, 40 MHz, MICROCONTROLLER, PQCC44
80C51 High Performance ROM 8-bit Microcontroller
|
Atmel, Corp.
ATMEL Corporation
|
