| PART |
Description |
Maker |
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
| PSB4600-FV1.2 |
PITA (PCI Interface for Telephony/Dat...
|
Infineon
|
| WLCSP5X5-25 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT527-1 |
Package outline
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|