| PART |
Description |
Maker |
| CBRLDSH2-40 CBRLDSH2-40-15 |
SURFACE MOUNT HIGH DENSITY HIGH DENSITY SCHOTTKY BRIDGE RECTIFIER
|
Central Semiconductor C...
|
| ISPLSI2096VE-100LT128 ISPLSI2096VE-135LT128 ISPLSI |
3.3V In-System Programmable SuperFAST?/a> High Density PLD
CRYSTAL 24.0 MHZ 20PF SMD
3.3V In-System Programmable SuperFASTHigh Density PLD
3.3V In-System Programmable SuperFAST High Density PLD
3.3V In-System Programmable SuperFAST⑩ High Density PLD
3.3VIn-SystemProgrammableSuperFASTHighDensityPLD
|
Lattice Semiconductor Corporation
LATTICE[Lattice Semiconductor]
|
| STP38N06 3645 |
N - CHANNEL ENHANCEMENT MODE ”ULTRA HIGH DENSITY POWER MOS TRANSISTOR
N - CHANNEL ENHANCEMENT MODE ULTRA HIGH DENSITY POWER MOS TRANSISTOR
From old datasheet system
N - CHANNEL ENHANCEMENT MODE ”ULTRA HIGH DENSITY” POWER MOS TRANSISTOR
|
STMICROELECTRONICS[STMicroelectronics]
|
| ISPLSI1016EA ISPLSI1016EA-100LJ44 ISPLSI1016EA-100 |
125 MHz in-system prommable high density PLD
100 MHz in-system prommable high density PLD
In-System Programmable High Density PLD
200 MHz in-system prommable high density PLD
|
Lattice Semiconductor
|
| DR127-100-R DR127-150-R DR127-101-R DR127-102-R DR |
High power density, high efficiency, shielded inductors
|
List of Unclassifed Man...
|
| W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L00 |
Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
|
CREE POWER
|
| CS291 CS291DW16 CS291DWR16 CS291N14 CS290 CS290DW1 |
Ignition Controller
IC AC/DC CONV 12V 200MA SIP10
IC AC/DC CONV -5V 200MA SIP10
|
Cherry Semiconductor Co...
CHERRY[Cherry Semiconductor Corporation]
ZF Electronics Corporation
|
| SDC320AD1224 |
High Power Density
|
XP Power Limited
|
| KSC1675COBU KSC1675CRBU KSC1675CYTA KSC1675O KSC16 |
NPN Epitaxial Silicon Transistor
FM/AM RF AMP, MIX, CONV,OSC,IF
FM/AM RF AMP/ MIX/ CONV/OSC/IF
|
FAIRCHILD[Fairchild Semiconductor]
|
| MJWI10-24D05 MJWI10-24D15 MJWI10-24S051 MJWI10-24S |
DC/DC CONVERTER 10W, High Power Density
|
Minmax Technology Co., Ltd.
|
| MVAC250-24AFD MVAC250-12AFD MVAC250-48AFD MVAC250- |
250W High Density AC-DC Power Supply
|
Murata Manufacturing Co., Ltd.
|
