| PART |
Description |
Maker |
| M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Corporation
|
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| S2HVM2.5 S2HVM10 S2HVM12.5 S2HVM15 S2HVM7.5 S2HVM5 |
STANDARD RECOVERY HIGH VOLTAGE RECTIFIER ASSEMBLY
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压2500V，高压，高密度，标准恢复整流器部
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压12500V，高压，高密度，标准恢复整流器部
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压7500V，高压，高密度，标准恢复整流器部
|
http://
Semtech Corporation
|
| 2-1418883-1 |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
Tyco Electronics
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| S71PL129JB0BAW9U3 S71PL129JB0BAI9U0 S71PL129JB0BAI |
JT 18C 18#20 PIN WALL RECP 堆叠式多芯片产品（MCP）的快闪记忆
JT 15C 14#20 1#16 PIN WALL REC SPECIALTY MEMORY CIRCUIT, PBGA64
JT 15C 14#20 1#16 SKT PLUG 堆叠式多芯片产品（MCP）的快闪记忆
JT 37C 37#22D SKT PLUG
Circular Connector; No. of Contacts:37; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:14-35 RoHS Compliant: No
Stacked Multi-Chip Product (MCP) Flash Memory
|
Spansion, Inc.
Spansion Inc.
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP)
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http://
SPANSION[SPANSION]
Spansion, Inc.
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
