| PART |
Description |
Maker |
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| 74270181 |
WE-TOF EMI Suppression Toroidal Ferrite
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 74270161 |
WE-TOF EMI Suppression Toroidal Ferrite
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 74270176 |
WE-TOF EMI Suppression Toroidal Ferrite
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
|
Spansion Inc.
Spansion, Inc.
|
| DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| EDS6-61H |
COMPACT ELECTROMAGNETIC FLOWMETER(COMPACT FLOW)
|
Fuji Electric
|
| SDA356JUF SDA276B SDA276C SDA276D SDA276E SDA276G |
600 V, 1 A fast and ultra fast rectifier assembly
100 V, 1.5 A bridge rectifier assembly
200 V, 1.5 A bridge rectifier assembly
400 V, 1.5 A bridge rectifier assembly
600 V, 1.5 A bridge rectifier assembly
1000 V, 1.5 A bridge rectifier assembly
1500 V, 1.5 A bridge rectifier assembly
800 V, 1 A fast and ultra fast rectifier assembly
1200 V, 1 A fast and ultra fast rectifier assembly
400 V, 1 A fast and ultra fast rectifier assembly
|
Solid State Devices Inc
|
| A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAMA82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位4Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
|
AMIC Technology, Corp.
AMIC Technology Corporation
|
