| PART |
Description |
Maker |
| S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP)
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http://
SPANSION[SPANSION]
Spansion, Inc.
|
| IR-1891 |
Multiple product fixture assemblies give increased process rates
|
TE Connectivity Ltd
|
| EFM8BB21F16A-C-QFN20 EFM8BB21F16A-C-QFN20R EFM8BB2 |
The addition of automotive devices in the product selection table and ordering information
|
Silicon Laboratories
|
| ATS043045006-PF030-17 |
Available with a variety of thermal adhesive tape options. Contact sales@qats.com for product configurations.
|
Advanced Thermal Soluti...
|
| TLN22707 TLN227F |
LEAD FREE PRODUCT FOR SPACE-OPTICAL-TRANSMISSION
|
Toshiba Semiconductor
|
| EM73361AAQ |
4-BIT MICRO-CONTROLLER FOR LCD PRODUCT
|
ELAN Microelectronics C...
|
| NFM15CC222D1C3 |
This product specification is applied to Chip EMIFIL
|
Murata Manufacturing Co...
|
| NFM21HC223R1H3 |
This product specification is applied to Chip EMIFIL
|
Murata Manufacturing Co...
|
| LTA67C LBA67C |
Lead (Pb) Free Product - RoHS Compliant
|
OSRAM GmbH
|
| BTM430 |
Bluetooth End Product Qualified
|
Laird Tech Smart Techno...
|
| PCN002254-042323 |
Product Process Change
|
Aavid Thermalloy, LLC
|
