| PART |
Description |
Maker |
| 21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| NTLUS3A90PZTAG NTLUS3A90PZTBG |
?0 V, ?.0 A, Cool Single P?Channel, ESD, 1.6x1.6x0.55 mm UDFN Package
|
Rectron Semiconductor
|
| NTLUS4195PZ NTLUS4195PZTAG NTLUS4195PZTBG |
Power MOSFET −30 V, −4.0 A, Cool Single P−Channel, ESD, 1.6x1.6x0.55 mm UDFN Package
|
ON Semiconductor
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
