| PART |
Description |
Maker |
| ST92F120 |
Heat Sink; Package/Case:TO-220; Thermal Resistance:24 C/W; Mounting Type:Through Hole; Length:19.05mm; Height:9.65mm; Width:19.05mm; Body Material:Plastic; Color:Pre Black Anondize; For Use With:TO-220 Packages RoHS Compliant: Yes
|
意法半导
|
| SM6J45A SM6G45 SM6G45A SM6J45 |
BI .DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE AC POWER CONTROL APPLICATIONS
TOSHIBA BI-DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE
TO-220 .75H .57W .5D W/MTG TAB
Heat Sink; Package/Case:TO-220; Body Material:Aluminum; Thermal Resistance:27.3 C/W; Color:Black; Leaded Process Compatible:No; Mounting Type:Through Hole; Peak Reflow Compatible (260 C):No; Size/Dimensions:0.750H x 0.500W"
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
|
| SGB06N60 SGD06N60 SGP06N60 Q67040-S4450 SGU06N60 Q |
Heat Sink; Package/Case:TO-220; Thermal Resistance:13.4 C/W; Mounting Type:Through Hole; Length:25.4mm; Height:12.7mm; Width:34.92mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
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|
INFINEON[Infineon Technologies AG]
|
| 384-1017 |
Clip-On Heat Sink
|
List of Unclassifed Manufacturers
|
| 780 |
Heat sink preheating not required
|
Laird Tech Smart Techno...
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE Electronics, Inc.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| LPD35-20B LPD35-35B LPD35-5B LPD35-10B LPD35-3B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| ATS-1104-C1-R0 |
Heat Sink for Half Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
| LPD45-25B LPD45-30B LPD45-10B LPD45-9B LPD45-6B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD70 LPD70-25B LPD70-30B LPD70-20B LPD70-40B LPD7 |
Low Pressure Drop Heat Sink
|
ALPHA
|
