| PART |
Description |
Maker |
| 19458 19458-3 |
THERMAL INTERFACE PAD (VI-J00)
THERMAL INTERFACE PAD, (VI-J00)
|
VICOR[Vicor Corporation]
|
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| H48-2K |
Thermal Conductive Pad on rolls
|
List of Unclassifed Manufacturers
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| MT8888 MT8888C MT8888CC MT8888CC-1 MT8888CE MT8888 |
CB 3C 3#16S SKT RECP WALL 综合DTMFTransceiver与英特尔微型接口
Integrated DTMFTransceiver with Intel Micro Interface
6V; 10mA; integrated DTMF transceiver with intel micro interface. For paging systems, repeater systems/mobile radio, credit card systems, personal computers, interconnect dialers
|
Mitel Networks Corporat...
TOKO, Inc.
MITEL[Mitel Networks Corporation]
Mitel Semiconductor
|
| ADM1032AR-1REEL ADM1032AR-1REEL7 ADM1032ARM-1 ADM1 |
High Accuracy, Remote Thermal Diode Monitor in Micro SOIC Package
|
Analog Devices
|
| MON35W42 |
Hardware Monitoring IC with Thermal Diode Interface
|
SMSC Corporation
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| NCT7491RQR2G |
Remote Thermal Monitor and Fan Controller with PECI 3.0 Interface and SMBus Compatible Master
|
ON Semiconductor
|
