| PART |
Description |
Maker |
| 7433-70061 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Anglewith or without Enhanced Shield, Version 4 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 74337-0037 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Angle,with Enhanced Shield, Version 1 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 82547GI |
Dual Footprint
|
Intel Corporation
|
| ACFM-2021 |
PCB footprint
|
AVAGO TECHNOLOGIES LIMI...
|
| 82547EI |
Dual Footprint
|
Intel Corporation
|
| BXB100-48S05FLTJ BXB100-48S12FLTJ BXB100 BXB100-24 |
Industry standard footprint
|
Emerson Network Power
|
| BXB50 BXB50-24S12FLTJ BXB50-24S3V3FLTJ BXB50-24S15 |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| KP3528BSKA2I-JX |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP3528F00C8I |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP1504WW0 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
