| PART |
Description |
Maker |
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| H48-2K |
Thermal Conductive Pad on rolls
|
List of Unclassifed Manufacturers
|
| KF2004-GM50 KF2004-GM50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GM Series
Thick film thermal printhead (with thermal historical control) 厚膜热敏打印头（热历史与控制
|
ROHM[Rohm]
Rohm CO.,LTD.
Rohm Co., Ltd.
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| LM75BIM-3 |
Digital Temperature Sensor and Thermal Watchdog with 2-Wire Interface
|
MAXIM - Dallas Semiconductor
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| AMRI-1000 |
Mobile Navigation Interface IC for Navigation Pad Module
|
AVAGO TECHNOLOGIES LIMITED
|
| AD5405YCPZ-REEL7 |
Dual 12-Bit , High Bandwidth, Multiplying DAC with 4 Quadrant Resistors and Parallel Interface; Package: LFCSP (6x6mm w.4.1mm pad); No of Pins: 40; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| AT77C104BCB08V- |
FingerChip thermal fingerprint sweep sensor, hardware based, navigation and click function, SPI interface.
|
Atmel
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| KD3004-DC70A KD3003-DF10A |
Thick film thermal printhead (with thermal historical control)
Compact high speed thick film thermal printhead (12 dots / mm)
|
ROHM[Rohm]
|
