| PART |
Description |
Maker |
| GBAV70 |
consists of two diodes
|
GTM
|
| GBAV70 |
consists of two diodes in a plastic surface mount
|
GTM CORPORATION
|
| IRIS-G6353 |
Hybrid IC consists from power MOSFET and a controller IC
|
IRF[International Rectifier]
|
| AP1511 |
AP1511 consists of step-down switching regulator
From old datasheet system
|
Anachip Corporation
|
| BAV99 |
The BAV99 consists of two diodes in a plastic surface mount package
|
FORMOSA[Formosa MS]
|
| AN2809 |
The LED7706 consists of a high-efficiency monolithic boost converter and six controlled
|
STMicroelectronics
|
| DMC6830 |
DMC6830 Is A REMOTE CONTROL TRANSMITTER, CONSISTS OF THE OPTIMIZED 4-BIT CPU WITH ROM AND RAM
|
DAEWOO[Daewoo Semiconductor]
|
| PC-16T1 |
KPTC 6C 6#20 PIN PLUG
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting)
|
KODENSHI CORP.
Kondenshi Corp
|
| PC-16T1 |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting)
|
KODENSHI[KODENSHI KOREA CORP.]
|
| PC-17K1C |
Photocoupler(Photocoupler consists of a Gallium Arsenide Infrared Emitting)
|
KODENSHI[KODENSHI KOREA CORP.]
Kodenshi Corp
|
| 1MC10-049-10 1MC10-049-15 1MC10-049-20 1MC10049 |
Thermoelectric Module
The MC10 is powered sub-series of large MC series of TE micro-modules. It consists of the following TEC types
|
RMT Ltd.
|
| TLP595G |
The Toshiba TLP595G consists of an aluminum gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET
|
Toshiba Semiconductor
|
