| PART |
Description |
Maker |
| VMMK-2103-15 |
0.5 to 6 GHz Bypass E-pHEMT LNA in Wafer Level Package
|
AVAGO TECHNOLOGIES LIMI...
|
| VMMK-2303 |
0.5 to 6 GHz 1.8 V E-pHEMT Shutdown LNA in Wafer Level Package
|
AVAGO TECHNOLOGIES LIMI...
Broadcom Corporation.
|
| VMMK-2403-BLKG |
2 to 4 GHz GaAs High Linearity LNA in Wafer Level Package
|
AVAGO TECHNOLOGIES LIMITED
|
| VMMK-1218 VMMK-1218-15 |
0.5 to 18 GHz Low Noise E-PHEMT in a Wafer Scale Package
|
Broadcom Corporation.
AVAGO TECHNOLOGIES LIMI...
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| 2683-100410 2683-200240 2683-200410 2683-100240 26 |
Quadruple-Mode LNA/Mixer Evaluation Kits
MAX2582 Evaluation Kit
Evaluation Kit for the MAX2601, MAX2602
Interface IC
Quad-Band TDD-WCDMA RF-to-Bits Radio Receiver 接口IC
|
Teledyne Technologies, Inc.
|
| S7U4E001A01 |
Sensing Evaluation Unit E-Series Basic Package
|
Epson Company
|
| MAX17116QEVKIT |
Evaluation Kit for the MAX17116 in a 24-Pin TQFN Package
|
MAXIM - Dallas Semiconductor
|
| 99-99-0995 99-99-0990 99-99-0994 99-99-0996 |
11CKT 2.5MM L/P WAFER ASY 526711AX 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
6CKT 2.5MM L/P WAFER ASY 526706AX 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
10CKT 2.5MM L/P WAFER ASY 526710AX 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
12CKT 2.5MM L/P WAFER ASY 526712AX 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
|
Molex, Inc.
|
| PECLDL-10-1 PECLDL-10-4 PECLDL-10-7 PECLDL-10-9 PE |
LTC3824 Evaluation Kit
LT3844EFE Evaluation Kit
LT3476EUHF Evaluation Kit
LTC3835EGN-1 Evaluation Kit 延迟线|可编程| 1线| 1 -技术咨询|混合|双酯| 32脚|塑料
DELAY LINE|PROGRAMMABLE|1-LINE|1-TAP|HYBRID|DIP|32PIN|PLASTIC 延迟线|可编程| 1线| 1 -技术咨询|混合|双酯| 32脚|塑料
|
Advanced Power Electronics, Corp.
|
