| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| LTV847M-V LTV847-V LTV847S-V LTV-817 LTV817-V LTV8 |
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| 5694F1 5694F3 5694F5 5694F7 |
High Density Right Angle Mounting T-1 LED Assembly
|
Chicago Miniature Lamp,inc
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| TLP521 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| IS2701-1 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
| IS357B |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| ISP521-1 ISP521-1X ISP521-2 ISP521-2X ISP521-4 ISP |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
ETC[ETC]
Electronic Theatre Controls, Inc.
|
