| PART |
Description |
Maker |
| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| TNPW2010 TNPW0805 TNPW1206 TNPW0402 TNPW1210 TNPW2 |
Ultra-stable thin film technology; Pulse resistant;
Thin Film Flat Chip Resistors;
High-Stability
Thin Film, Rectangular, Resistor Chips
Thin Film/ Rectangular/ Resistor Chips
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
|
Infineon
|
| PCI6152-XX66BC PCI6152-XX33PC PCI6152-XX33BC PCI61 |
FastLane?/a> PCI-to-PCI Bridge Chips
FastLane PCI-to-PCI Bridge Chips
FastLane⑩ PCI-to-PCI Bridge Chips
|
PLX Technology
|
| Y4045249K000A0W Y4047249K000A0W Y4475249K000A0W Y4 |
Bulk Metal? Foil Technology Discrete Chips with TCR of 2 ppm/°C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal庐 Foil Technology Discrete Chips with TCR of 2 ppm/掳C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal垄莽 Foil Technology Discrete Chips with TCR of 2 ppm/隆?C and Tolerance to 0.005 % for use in Hybrid Circuits
Bulk Metal㈢ Foil Technology Discrete Chips with TCR of 2 ppm/∑C and Tolerance to 0.005 % for use in Hybrid Circuits
|
Vishay Siliconix
|
| GT-6816 |
SCANNER Chips
|
ETC
|
| SB140-1.1 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
