| PART |
Description |
Maker |
| DSPA56371 |
The DSP56371 is a high density CMOS device with 5.0-volt compatible inputs and outputs.
|
FREESCALE[Freescale Semiconductor, Inc]
|
| DSP56374PB/D DSP56300FM/AD DSP56374UM/D DSPB56374A |
The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs.
Freescale Semiconductor
|
Freescale Semiconductor, Inc
Freescale Semiconductor...
|
| ATV750 ATV750-20DM ATV750-20DM_883 ATV750-20GM ATV |
THERMISTOR GLASS 250 OHM DO-35 UV PLD, 25 ns, CDIP24
THERMISTOR GLASS 1K OHM DO-35 OT PLD, 25 ns, PDIP24
THERMISTOR GLASS 10K OHM DO-35 OT PLD, 25 ns, PDIP24
THERMISTOR GLASS 30K OHM DO-35 UV PLD, 25 ns, CDIP24
High Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDIP24
High Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDSO24
High Density UV Erasable Programmable Logic Device UV PLD, 20 ns, CDIP24
High Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PQCC28
High Density UV Erasable Programmable Logic Device OT PLD, 20 ns, CQCC28
High Density UV Erasable Programmable Logic Device OT PLD, 20 ns, CDIP24
High Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PDIP24
|
ATMEL[ATMEL Corporation]
Atmel Corp.
Atmel, Corp.
|
| MACH211SP-12 MACH211SP-7JC MACH211SP-7VC MACH211SP |
RES 35.7K-OHM 1% 0.1W 100PPM THICK-FILM SMD-0603 5K/REEL-7IN-PA
SCREW MACHINE SLOTTED 6-32X3/4
High-Density EE CMOS Programmable Logic EE PLD, 16 ns, PQCC44
High-Density EE CMOS Programmable Logic 高密度电子工程CMOS可编程逻辑
|
Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| MACH215-15JC MACH215-20JC MACH215-12JC MACH215-12 |
High-Density EE CMOS Programmable Logic
High-Density EE CMOS Programmable Logic EE PLD, 20 ns, PQCC44
High-Density EE CMOS Programmable Logic EE PLD, 15 ns, PQCC44
|
LATTICE SEMICONDUCTOR CORP
Lattice Semiconductor, Corp.
|
| XCF128XFTG64C DS617 XCF32PV0G48C |
Platform Flash XL High-Density Configuration and Storage Device 8M X 16 FLASH 1.8V PROM, 85 ns, PBGA64
Platform Flash XL High-Density Configuration
|
Xilinx, Inc.
|
| AM7200-35RC AM7200-35JC AM7200-35PC AM7200-50JC AM |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 25 ns, PDIP28
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY 256 X 9 OTHER FIFO, 50 ns, PDIP28
Circular Connector; No. of Contacts:13; Series:MS27508; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
JT 13C 13#22D PIN WALL RECP
|
ADVANCED MICRO DEVICES INC
Advanced Micro Devices, Inc.
|
| MACH220-10 MACH220-10JC MACH220-10JI MACH220-12 MA |
High-Density EE CMOS Programmable Logic
|
Advanced Micro Devices
|
| MACH110-12JC MACH110-15JC MACH110-20JC MACH110-12 |
High-Density EE CMOS Programmable Logic
|
LATTICE[Lattice Semiconductor]
|
| MACH215-12 MACH215-12JC MACH215-15JC MACH215-20JC |
High-Density EE CMOS Programmable Logic
|
LATTICE[Lattice Semiconductor]
|
| AM7200-25 AM7200-25JC AM7200-25PC AM7200-25RC AM72 |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY
|
Advanced Micro Devices
|
| 74AHC2G00 74AHC2G00DC 74AHC2G00DP 74AHCT2G00DP 74A |
74AHC2G00; 74AHCT2G00; 2-input NAND gate
THE 74AHC2G/AHCT2G00 IS A HIGH-SPEED SI-GATE CMOS DEVICE
The 74AHC2G/AHCT2G00 is a high-speed Si-gate CMOS device
|
PHILIPS[Philips Semiconductors]
NXP Semiconductors
|
