| PART |
Description |
Maker |
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV-849 LTV-849M LTV-849S LTV-829 LTV-829S-TA LTV8 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
LITEON[Lite-On Technology Corporation]
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| TIL199A |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
N.A.
|
| IS357A |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
ISOCOM
|
| LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司
Lite-On Technology Corporation
|
