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3Z301A S6400 DS1238 DSB5818 ISL84516 U30D10C 1N4892A BC184L
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  package outline marking layout Datasheet PDF File

For package outline marking layout Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
Part No. MSA20
Description 20-Lead Shrink Small outline package (SSOP), EIAJ TYPE II, 5.3mm Wide package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20

File Size 12.07K  /  1 Page

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    TAJA106M006RNJ TAJT106K010RNJ TAJD336M010RNJ

AVX Corporation
Part No. TAJA106M006RNJ TAJT106K010RNJ TAJD336M010RNJ
Description marking
TAJ, TRJ, THJ, TAW, TPS, TPM, NOJ, NOS, NOM, NPV, TAC, TPC, TCJ and TLJ
For TAJ, TPS & THJ, the positive end of body has videcon readable polarity marking as shown in the diagram.

File Size 56.12K  /  1 Page

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    SOT27-1

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. SOT27-1
Description package outline

File Size 9.12K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TSOT23-5
Description package outline

File Size 209.54K  /  1 Page

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    Global Mixed-mode Techn...
Part No. SOT23-6
Description package outline

File Size 113.60K  /  1 Page

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    Global Mixed-mode Techn...
Part No. SOT23-5
Description package outline

File Size 112.64K  /  1 Page

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    Global Mixed-mode Techn...
Part No. SOT23-3
Description package outline

File Size 113.33K  /  1 Page

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    Global Mixed-mode Techn...
Part No. WQFN7X7-56
Description package outline

File Size 178.63K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TDFN3X3-8
Description package outline

File Size 183.03K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TDFN3X3-6
Description package outline

File Size 116.62K  /  1 Page

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For package outline marking layout Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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