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Amphenol Communications Solutions |
| Part No. |
10146175-328KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 28 position
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10146175-326KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 26 position
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
HS30753261
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| Description |
Backplane connectors,cable backplane ,Paladin 4X8 Cable, 28 AWG, 40 GHz
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10146175-320KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 20 position
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10146175-324KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 24 position
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10146175-322KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 22 position
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| Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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| Part No. |
15-47-7532 0015477532
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating
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| File Size |
377.43K /
4 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com

Price and Availability
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