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Molex Electronics Ltd.
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| Part No. |
87891-0204 0878910204
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, tray Packaging, Lead-free
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| File Size |
759.42K /
10 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
87914-1816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87891-0601 0878910601
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025渭m (1渭) Gold (Au) Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025μm (1μ) Gold (Au) Plating, tray Packaging, Lead-free
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| File Size |
759.15K /
10 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0879143435 87914-3435
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, tray Packaging, Lead-free
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| File Size |
3,776.94K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0877580817 87758-0817
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket tray Packaging, Lead-free
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| File Size |
170.96K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0877580816 87758-0816
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket tray Packaging, Lead-free
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| File Size |
170.91K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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