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NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
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| Part No. |
CGY2032BTS
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| OCR Text |
...s SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable sui... |
| Description |
DECT 500 mW power amplifier(DECT 500 mW 功率放大
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| File Size |
61.06K /
12 Page |
View
it Online |
Download Datasheet
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NXP Semiconductors Philips Semiconductors
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| Part No. |
CGY2032TS
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| OCR Text |
...s SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable sui... |
| Description |
DECT 500 mW power amplifier
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| File Size |
60.20K /
12 Page |
View
it Online |
Download Datasheet
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Price and Availability
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