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IRF[International Rectifier]
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| Part No. |
AN-994-1
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| OCR Text |
... also be capable of maintaining adhesion during the preheat cycle and it should not become a deterrent to solder flow during the reflow or wave soldering process. Typical adhesives of this type are made from non-activated resins (R), which ... |
| Description |
MAXIMIZING THE EFFECTIVENESS OF YOUR SMD ASSEMBLIES
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| File Size |
117.08K /
7 Page |
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EPCOS[EPCOS]
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| Part No. |
B82432-T
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| OCR Text |
...le for soldering and conductive adhesion No leaching during wave soldering
Marking Marking on component: Manufacturer and letter T, L value (in H) and tolerance of L value (coded), date of manufacture (coded) Minimum data on reel: Manufa... |
| Description |
Size 1812 (EIA) or 4532 (IEC) Rated inductance 1,0 to 1000 mH Rated current 60 to 1300 mA
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| File Size |
45.60K /
2 Page |
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it Online |
Download Datasheet |
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SEOUL[Seoul Semiconductor]
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| Part No. |
BW104-S
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| OCR Text |
...ance/10 pitches to be 0.2mm (3) adhesion Strength of Cover Tape : adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LT... |
| Description |
CHIP LED DEVICE
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| File Size |
351.55K /
10 Page |
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it Online |
Download Datasheet |
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Price and Availability
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