| |
|
 |
Molex Electronics Ltd.
|
| Part No. |
0901362330 90136-2330
|
| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.50K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TB62210FNG
|
| Description |
Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1/Phase Interface
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
78290-136HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361103 90136-1103
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68690-136HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361104 90136-1104
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69190-136HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361105 90136-1105
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021221-00010T4LF
|
| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 10 Positions, 1.27mm (0.500in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361108 90136-1108
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10131319-2222100LF
|
| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361106 90136-1106
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021221-00008T4LF
|
| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901361107 90136-1107
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021221-000A0D8LF
|
| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
98122-1001LF
|
| Description |
Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Extended
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021221-00040D4LF
|
| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 40 Positions, 1.27mm (0.500in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
