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Molex Electronics Ltd.
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| Part No. |
A-7720-B03HP909B 0022268032 22-26-8032
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| Description |
2.54mm (.100) KK? IDT Double Cantilever Contact, 3 Circuits, Tin (Sn), Feed-Through, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat 2.54mm (.100) KK庐 IDT Double Cantilever Contact, 3 Circuits, Tin (Sn), Feed-Through, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat Molex Electronics Ltd.
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| File Size |
484.92K /
20 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68031-114HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-122HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-415HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-411HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-213HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-211HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-226HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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| Part No. |
EF6803-1PV EF6803U4PV EF6803PV EF6801U4PV
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| Description |
480MHz, Video Buffer with Output Disable; Temperature Range: 0°C to 70°C; Package: 8-SOIC 480MHz, Video Buffer with Output Disable; Temperature Range: 0°C to 70°C; Package: 8-PDIP 120MHz, Low Power, 8x8 Video Crosspoint Switch; Temperature Range: 0°C to 70°C; Package: 44-PLCC
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| File Size |
1,619.54K /
49 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68033-224HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-117HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-121HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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