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  87759-4814 Datasheet PDF File

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    87759-0465

Molex Electronics Ltd.
Part No. 87759-0465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 280.44K  /  6 Page

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Texas Instruments

Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-0674

Molex Electronics Ltd.
Part No. 87759-0674
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 421.17K  /  8 Page

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Texas Instruments

Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    87759-0814

Molex Electronics Ltd.
Part No. 87759-0814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Texas Instruments

Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

    87759-0815

Molex Electronics Ltd.
Part No. 87759-0815
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 8 Circuits

File Size 279.45K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-148-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1874

Molex Electronics Ltd.
Part No. 87759-1874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 68481-472
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0874

Molex Electronics Ltd.
Part No. 87759-0874
Description 2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 68481-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 68481-436HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4464

Molex Electronics Ltd.
Part No. 87759-4464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 421.15K  /  8 Page

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Amphenol Communications Solutions

Part No. 68481-456HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 98481-427LF
Description Dubox<sup>reg:</sup>, Wire To Board connector, Shrouded Header, Single Row, Straight, 27 Position.
Tech specs    

Official Product Page

    87759-4665

Molex Electronics Ltd.
Part No. 87759-4665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-814-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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