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  87759-3815 Datasheet PDF File

For 87759-3815 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-7637

Molex Electronics Ltd.
Part No. 87759-7637
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.71K  /  6 Page

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Amphenol Communications Solutions

Part No. 59112-T38-15-135LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3276

Molex Electronics Ltd.
Part No. 87759-3276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 77313-815-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    87759-1464

Molex Electronics Ltd.
Part No. 87759-1464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 421.26K  /  8 Page

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Amphenol Communications Solutions

Part No. 59202-G38-15P144LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 77313-815-06LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
Tech specs    

Official Product Page

    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.97K  /  8 Page

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Amphenol Communications Solutions

Part No. 59202-G38-15A139LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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    V23815-K1306-M136

Infineon Technologies AG
Part No. V23815-K1306-M136
Description PAROLI Tx AC, 1.25 Gbit/s 帕罗利得克萨斯州,交.25千兆

File Size 476.91K  /  27 Page

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    EPCOS AG
EPCOS[EPCOS]
Part No. B39391-B3815-Z810 B3815
Description SAW Components Low-loss Filter 385,0 MHz

File Size 69.83K  /  7 Page

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    87759-4250 87759-4251

Molex Electronics Ltd.
Part No. 87759-4250 87759-4251
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.05K  /  4 Page

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