87759-1851 pdf Datasheet P9 Part Num --- IC-ON-LINE


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87759-1851 Datasheet PDF File

For 87759-1851 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	87759-4075
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size	279.39K / 6 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	5962-8775901MSA
Description	Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	87759-3275
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size	280.29K / 6 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	5962-8775901MRA
Description	Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	44472-1851
Description	4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 18 Circuits, PA Polyamide Nylon 6/6 94V-0, without Drain Holes
File Size	226.06K / 5 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	5962-8775901M2A
Description	Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs				Official Product Page

					Analog Devices, Inc.
Part No.	AD1851
Description	16-Bit, 16×Fs PCM Audio DACs(16单片PCM音频D/A转换
File Size	201.73K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-127HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

					Unisonic Technologies
Part No.	GM1851
Description	GROUND FAULT INTERRUPTER
File Size	396.46K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-104HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

					UTC[Unisonic Technologies]
Part No.	LM1851
Description	GROUND FAULT INTERRUPTER
File Size	156.88K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-116HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

					eupec GmbH
Part No.	T1851N
Description	Phase Control Thyristor
File Size	271.88K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-133HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87759-1450 87759-1451
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
File Size	174.22K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10110818-5100HFLF
Description	SFP+ Cable Assembly, 24 AWG, 10.0 meters, passive -standard raw cable, halogen free.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87759-4851 87759-4850
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size	174.05K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-8516-11D
Description	Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87759-0850 87759-0851
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
File Size	174.11K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-134HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

For 87759-1851 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

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