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Molex Electronics Ltd.
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| Part No. |
87758-4016 0877584016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
76342-417LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 34 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92417-104HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92417-130HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5016 0877585016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
92417-150HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92417-402HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581250 87758-1250
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
92417-424HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-3217 0877583217
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
92417-444HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92417-466HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5017 0877585017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-409241700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92417-118HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
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| Tech specs |
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Official Product Page
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