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  87758-0416 Datasheet PDF File

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    0877584416

Molex Electronics Ltd.
Part No. 0877584416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 76345-104-16LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877584617 87758-4617

Molex Electronics Ltd.
Part No. 0877584617 87758-4617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-410041600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-041602PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    87758-4050 0877584050

Molex Electronics Ltd.
Part No. 87758-4050 0877584050
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 86840-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

    87758-4016 0877584016

Molex Electronics Ltd.
Part No. 87758-4016 0877584016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-419041650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-041606LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    87758-4017 0877584017

Molex Electronics Ltd.
Part No. 87758-4017 0877584017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 71920-416LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 16 position, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    87758-3217 0877583217

Molex Electronics Ltd.
Part No. 87758-3217 0877583217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 51940-416LF
Description PwrBlade®, Power Supply Connectors, 4P 20S 3P Vertical Receptacle.
Tech specs    

Official Product Page

    87758-2650 0877582650

Molex Electronics Ltd.
Part No. 87758-2650 0877582650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-041622LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0877581250 87758-1250

Molex Electronics Ltd.
Part No. 0877581250 87758-1250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-4162-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

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