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  7149.9019.03 Datasheet PDF File

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    ATS019019010-MF-6I

Advanced Thermal Solutions, Inc.
Part No. ATS019019010-MF-6I
Description 19.00 x 19.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 66429-019LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS019019013-MF-6L

Advanced Thermal Solutions, Inc.
Part No. ATS019019013-MF-6L
Description 19.00 x 19.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 65039-019ELF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Single Row.
Tech specs    

Official Product Page

    ATS019019012-PF-6K

Advanced Thermal Solutions, Inc.
Part No. ATS019019012-PF-6K
Description 19.00 x 19.00 x 12.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.03K  /  1 Page

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Amphenol Communications Solutions

Part No. 65239-019LF
Description Dubox® 2.54mm, Crimp-to-Wire Housing, Double Row, 38 Position.
Tech specs    

Official Product Page

    ATS019019013-PF-6L

Advanced Thermal Solutions, Inc.
Part No. ATS019019013-PF-6L
Description 19.00 x 19.00 x 13.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 67289-019
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    ATS019019010-SF-6I

Advanced Thermal Solutions, Inc.
Part No. ATS019019010-SF-6I
Description 19.00 x 19.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 65039-019LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Single Row.
Tech specs    

Official Product Page

    ATS019019014-PF-6M

Advanced Thermal Solutions, Inc.
Part No. ATS019019014-PF-6M
Description 19.00 x 19.00 x 14.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.03K  /  1 Page

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Amphenol Communications Solutions

Part No. 67289-019LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    ATS019019015-PF-6N

Advanced Thermal Solutions, Inc.
Part No. ATS019019015-PF-6N
Description 19.00 x 19.00 x 15.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 249.90K  /  1 Page

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    ATS019019014-MF-6M

Advanced Thermal Solutions, Inc.
Part No. ATS019019014-MF-6M
Description 19.00 x 19.00 x 14.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.94K  /  1 Page

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    ATS019019010-PF-6I

Advanced Thermal Solutions, Inc.
Part No. ATS019019010-PF-6I
Description 19.00 x 19.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.03K  /  1 Page

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    ATS019019012-MF-6K

Advanced Thermal Solutions, Inc.
Part No. ATS019019012-MF-6K
Description 19.00 x 19.00 x 12.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.99K  /  1 Page

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