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Fujitsu Limited
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| Part No. |
MB8116160A-70
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| Description |
CMOS 1 M ×16 BIT
Fast Page Mode DRAM(CMOS 1 M ×16 位快速页面存取模式动态RAM)
CMOS 1 M ?16 BIT Fast Page Mode DRAM(CMOS 1 M ?16 浣?揩??〉?㈠???ā寮????AM)
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| File Size |
329.44K /
25 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10043343-202
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| Description |
300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10043343-202LF
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| Description |
300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-320-22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69168-116HLF
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| Description |
PV® Wire-to-Board Connector System, 2 Wall Shrouded Header - Through Hole - Double row - 16 Positions 2.54mm - Vertical.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68498-116HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76308-116
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| Description |
Dubox® 2.54mm, Board to Board Connector, 16 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68481-164HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE724881161
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| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1167 0309681167
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
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| File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10143578-116KLF
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| Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 16 Position,staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78938-116HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Bom2Buy.com
Price and Availability
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