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  4163-0 Datasheet PDF File

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Part No. UPD4564163G5-A10BL-9JF UPD4564163G5-A10L-9JF UPD4564163G5-A80L-9JF
Description x16SDRAM

File Size 5,416.28K  /  83 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TPD4163K
Description Intelligent power device (High voltage PWM DC brushless motor driver) / VBB=600 V / Iout=1 A / HDIP30
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    INTERSIL[Intersil Corporation]
Part No. X4165S8 X4163S8-4.5A X4165V8I-4.5A X4163 X4163S8 X4163S8-2.7 X4163S8-2.7A X4163S8I X4163S8I-2.7 X4163S8I-2.7A X4163S8I-4.5A X4163V8 X4163V8-2.7 X4163V8-2.7A X4163V8-4.5A X4163V8I X4163V8I-2.7 X4163V8I-2.7A X4163V8I-4.5A X4165S8-2.7 X4165S8-2.7A X4165S8-4.5A X4165S8I X4165S8I-2.7 X4165S8I-2.7A X4165S8I-4.5A X4165V8 X4165V8-2.7 X4165V8-2.7A X4165V8-4.5A X4165V8I X4165V8I-2.7 X4165V8I-2.7A
Description CPU Supervisor with 16K EEPROM
File Size 318.10K  /  21 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TPD4163F
Description Intelligent power device (High voltage PWM DC brushless motor driver) / VBB=600 V / Iout=1 A / HSSOP31
Tech specs 　 　

Official Product Page

    MC34163 MC34163DW MC34163P MC33163DW MC33163P ON1105 MC33163

ONSEMI[ON Semiconductor]
Part No. MC34163 MC34163DW MC34163P MC33163DW MC33163P ON1105 MC33163
Description From old datasheet system
POWER SWITCHING REGULATORS
File Size 395.73K  /  16 Page

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Amphenol Communications Solutions
Part No. 77314-163LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    K4S641632F-TL55 K4S641632F-TL70 K4S641632F-TC70 K4S641632F-TC60 K4S641632F-TC75 K4S641632F-TL75 K4S641632F K4S641632F-TC

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S641632F-TL55 K4S641632F-TL70 K4S641632F-TC70 K4S641632F-TC60 K4S641632F-TC75 K4S641632F-TL75 K4S641632F K4S641632F-TC1H K4S641632F-TC1L K4S641632F-TC50 K4S641632F-TC55 K4S641632F-TL1H K4S641632F-TL1L K4S641632F-TL50 K4S641632F-TL60
Description RF CONNECTOR; FME PLUG, CRIMP ATTACHMENT FOR RG58
RF CONNECTOR; 75 OHM MCX JACK, SURFACE MOUNT
Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 8-CDIP -55 to 125
64Mbit SDRAM 1M x 16Bit x 4 Banks Synchronous DRAM LVTTL
File Size 132.29K  /  11 Page

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Amphenol Communications Solutions
Part No. 85674-163LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Press Fit.
Tech specs 　 　

Official Product Page

    K4S641632E-TC1H K4S641632E-TC1L K4S641632E-TC50 K4S641632E-TC55 K4S641632E-TC70 K4S641632E-TL1H K4S641632E-TL1L K4S64163

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S641632E-TC1H K4S641632E-TC1L K4S641632E-TC50 K4S641632E-TC55 K4S641632E-TC70 K4S641632E-TL1H K4S641632E-TL1L K4S641632E-TL50 K4S641632E-TL55 K4S641632E-TL60 K4S641632E-TL70 K4S641632E-TL75 K4S641632E-TC75 K4S641632E K4S641632E-TC60
Description 4M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54
Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 20-LCCC -55 to 125
64Mbit SDRAM
File Size 127.89K  /  10 Page

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Amphenol Communications Solutions
Part No. 10080054-163LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    K4S641632C-TC/L10 K4S641632C-TC/L1H K4S641632C-TC/L1L K4S641632C-TC/L60 K4S641632C-TC/L70 K4S641632C-TC/L75 K4S641632C-T

SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S641632C-TC/L10 K4S641632C-TC/L1H K4S641632C-TC/L1L K4S641632C-TC/L60 K4S641632C-TC/L70 K4S641632C-TC/L75 K4S641632C-TC/L80
Description 1M x 16Bit x 4 Banks Synchronous DRAM
File Size 1,162.23K  /  42 Page

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Amphenol Communications Solutions
Part No. 10069524-163602LF
Description Bergstak® 0.80mm Pitch, Board to Board Receptacle, Vertical, Double Row, 160 Positions, 0.80mm (0.031in) Pitch
Tech specs 　 　

Official Product Page

    MC33163DW MC33163P MC34163DW MC34163DWR2 MC34163P

Motorola
ON Semiconductor
Part No. MC33163DW MC33163P MC34163DW MC34163DWR2 MC34163P
Description POWER SWITCHING REGULATORS
File Size 399.75K  /  16 Page

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Amphenol Communications Solutions
Part No. 10069524-163402LF
Description Bergstak® 0.80mm Pitch, Board to Board Receptacle, Vertical, Double Row, 160 Positions, 0.80mm (0.031in) Pitch
Tech specs 　 　

Official Product Page

    SGA4163ZSQ SGA4163ZSR SGA4163ZPCK1

RF Micro Devices
Part No. SGA4163ZSQ SGA4163ZSR SGA4163ZPCK1
Description DC to 5000MHz, CASCADABLE SiGe HBT MMIC AMPLIFIER
File Size 364.15K  /  6 Page

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Amphenol Communications Solutions
Part No. 10144754-1631LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 15u\\ Gold plating, 16 Positions, Black Color, LCP, GW Compatible, Tray packing.
Tech specs 　 　

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    HYNIX SEMICONDUCTOR INC
Part No. HYM7V641630TKG-12
Description 16M X 64 SYNCHRONOUS DRAM MODULE, 9 ns, PDMA168
File Size 687.17K  /  15 Page

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Amphenol Communications Solutions
Part No. 10137924-1631LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, GW Compatible LCP.
Tech specs 　 　

Official Product Page

    MB82DBS04163C-70LWFKT

Fujitsu Component Limited.
Part No. MB82DBS04163C-70LWFKT
Description MEMORY Mobile FCRAMTM CMOS 64 M Bit (4 M word×16 bit) Mobile Phone Application Specific Memory
File Size 372.71K  /  62 Page

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Amphenol Communications Solutions
Part No. 10137924-1632LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, Non GW Compatible LCP.
Tech specs 　 　

Official Product Page

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