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  1140-2036 Datasheet PDF File

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    11-40-2091 1140-2091 0011-40-2091

Molex Electronics Ltd.
Part No. 11-40-2091 1140-2091 0011-40-2091
Description Terminator Die

File Size 19.43K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-40-2151 1140-2151 0011-40-2151

Molex Electronics Ltd.
Part No. 11-40-2151 1140-2151 0011-40-2151
Description Terminator Die

File Size 19.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 67292-036LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 72 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    1140-4016 0011-40-4016

Molex Electronics Ltd.
Part No. 1140-4016 0011-40-4016
Description Conductor Punch

File Size 11.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    11-40-2064 1140-2064 0011-40-2064

Molex Electronics Ltd.
Part No. 11-40-2064 1140-2064 0011-40-2064
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-820-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2044 1140-2044 0011-40-2044

Molex Electronics Ltd.
Part No. 11-40-2044 1140-2044 0011-40-2044
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 20.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-120-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    11-40-2042 1140-2042 0011-40-2042

Molex Electronics Ltd.
Part No. 11-40-2042 1140-2042 0011-40-2042
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 51140-0305
Description 3.96 W/W RETAINER 511400305 INTERCONNECTION DEVICE

File Size 33.77K  /  1 Page

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Amphenol Communications Solutions

Part No. UE863G262020361
Description 2X2SFP ULTRAPORT W/H LP
Tech specs    

Official Product Page

    A-71395-1140

Molex Electronics Ltd.
Part No. A-71395-1140
Description 2.54mm (.100) Pitch C-Grid垄莽 PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 40 Circuits

File Size 736.43K  /  6 Page

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Amphenol Communications Solutions

Part No. UE86S442C20361
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4 SFP COMBO THERMAL.
Tech specs    

Official Product Page

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