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  0154.630 Datasheet PDF File

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    0015477652

Molex Electronics Ltd.
Part No. 0015477652
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-415HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477628

Molex Electronics Ltd.
Part No. 0015477628
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-410HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477648

Molex Electronics Ltd.
Part No. 0015477648
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-406HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477650

Molex Electronics Ltd.
Part No. 0015477650
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477646

Molex Electronics Ltd.
Part No. 0015477646
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-407HALF
Description BS SR RA HDR TR 1X7
Tech specs    

Official Product Page

    0015477642

Molex Electronics Ltd.
Part No. 0015477642
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-G38-20-154LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0015477644

Molex Electronics Ltd.
Part No. 0015477644
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-401HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477640

Molex Electronics Ltd.
Part No. 0015477640
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-416HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477624

Molex Electronics Ltd.
Part No. 0015477624
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded

File Size 377.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-421HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477626

Molex Electronics Ltd.
Part No. 0015477626
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-424HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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