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For w glass Found Datasheets File :: 20967 Search Time::1.328ms
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				Toshiba Semiconductor
Part No.	TPCS820807 TPCS8208
OCR Text	...h Tstg Rating 20 20 12 6 24 1.1 w 0.75 Unit V V V A JEDEC JEITA TOSHIBA 2-3R1E Drain power dissipation Single-device value (t = 1...glass-epoxy board (a) FR-4 25.4 x 25.4 x 0.8 (unit: mm) b) Device mounted on a glass-epoxy bo...
Description	Lithium Ion Battery Applications
File Size	188.04K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS820407 TPCS8204
OCR Text	...h Tstg Rating 20 20 12 6 24 1.1 w 0.75 Unit V V V A JEDEC JEITA TOSHIBA 2-3R1E Drain power dissipation (t = 10 s) Single-devic...glass-epoxy board (a) FR-4 25.4 x 25.4 x 0.8 (unit: mm) b) Device mounted on a glass-epoxy bo...
Description	Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications
File Size	183.07K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS810507 TPCS8105
OCR Text	....11 150 -55 to 150 Unit V V V A w w mJ A mJ C C JEDEC JEITA TOSHIBA 2-3R1F weight: 0.035 g (typ.) Circuit Configuration 8 7 6...glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit:...
Description	Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications
File Size	250.24K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS810407 TPCS8104
OCR Text	....11 150 -55 to 150 Unit V V V A w w mJ A mJ C C 1 2 3 4 JEDEC JEITA TOSHIBA 2-3R1B weight: 0.035 g (typ.) Pulse (Note 1) Dr...glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit:...
Description	Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications
File Size	243.03K / 7 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	TPCS8009-H
OCR Text	...g Rating 150 150 20 2.1 8.4 1.5 w 0.6 3 2.1 0.15 150 -55~150 mJ A mJ C C Unit V V V A 1.2.3. Source 4 Gate 5.6.7.8 Drain JEDEC JEITA TOS...glass-epoxy board (a) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit: ...
Description	High-Speed Switching Applications Switching Regulator Applications DC/DC Converter Applications
File Size	229.94K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCF8104
OCR Text	...t = 5 s) (note 2a) p d 2.5 w drain power dissipation (t = 5 s) (note 2b) p d 0.7 w single pulse avalanche energy (note 3) e as...glass-epoxy board (a) (b) device mounted on a glass-epoxy board (b) note 3: v dd = ? 24 ...
Description	Notebook PC Applications
File Size	250.03K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS8008-H
OCR Text	...g Rating 250 250 20 1.7 6.8 1.5 w 0.6 1.7 1.7 0.15 150 -55~150 mJ A mJ C C Unit V V V A 1.2.3. Source 4 Gate 5.6.7.8 Drain JEDEC JEITA...glass-epoxy board (a) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit: ...
Description	High-Speed Switching Applications Switching Regulator Applications DC/DC Converter Applications
File Size	209.81K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS8007-H
OCR Text	...g Rating 200 200 20 1.9 7.6 1.5 w 0.6 2.3 1.9 0.15 150 -55~150 mJ A mJ C C Unit V V V A 1.2.3. Source 4 Gate 5.6.7.8 Drain JEDEC JEITA...glass-epoxy board (a) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit: ...
Description	High-Speed Switching Applications Switching Regulator Applications DC/DC Converter Applications
File Size	229.78K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCS800407
OCR Text	...g Rating 200 200 20 1.3 5.2 1.5 w 0.6 1.05 1.3 0.15 150 -55~150 mJ A mJ C C 8 7 6 5 Unit V V V A Pulse (Note 1) JEDEC JEITA TOSHIBA ...glass-epoxy board (a) FR-4 25.4 x 25.4 x 0.8 (unit: mm) b) Device mounted on a glass-epoxy bo...
Description	High-Speed Switching Applications Switching Regulator Applications DC-DC Converter Applications
File Size	262.38K / 7 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCP8J0107
OCR Text	...G Drain power dissipation w 1.06 w weight: 0.011 g (typ.) 5.8 -3 0.21 mJ A mJ Circuit Configuration 8 7 6 5 BRT ...glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 Unit: ...
Description	TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type
File Size	305.31K / 9 Page	View it Online	Download Datasheet

For w glass Found Datasheets File :: 20967 Search Time::1.328ms
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