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  TDL3-0513 Datasheet PDF File

For TDL3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    51353-3800 0513533800

Molex Electronics Ltd.
Part No. 51353-3800 0513533800
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 38 circuits

File Size 242.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51353-4000 0513534000

Molex Electronics Ltd.
Part No. 51353-4000 0513534000
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive LockDual Row, 40 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 40 circuits

File Size 242.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0513820800 51382-0800

Molex Electronics Ltd.
Part No. 0513820800 51382-0800
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Single Row, 8 circuits

File Size 140.92K  /  3 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    51336-0810 0513360810

Molex Electronics Ltd.
Part No. 51336-0810 0513360810
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 8Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 8Circuits

File Size 99.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51353-2600 0513532600

Molex Electronics Ltd.
Part No. 51353-2600 0513532600
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 26 circuits
2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Receptacle Housing, Positive LockDual Row, 26 circuits

File Size 242.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    0513010404

Molex Electronics Ltd.
Part No. 0513010404
Description CRC Shielded Rectangular I/O Plug Housing, For Plug Assembly, Female TerminalPower, 4 Circuits, Polarization Type D, Polarization Position B-2
CRC垄芒 Shielded Rectangular I/O Plug Housing, For Plug Assembly, Female TerminalPower, 4 Circuits, Polarization Type D, Polarization Position B-2

File Size 110.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0513460300 51346-0300

Molex Electronics Ltd.
Part No. 0513460300 51346-0300
Description 3.30mm (.130") Pitch Wire-to-Wire Plug Housing, Positive Lock, Single Row, 3 Circuits,
3.30mm (.130) Pitch Wire-to-Wire Plug Housing, Positive Lock, Single Row, 3 Circuits,

File Size 220.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90858-0513 0908580513

Molex Electronics Ltd.
http://
Part No. 90858-0513 0908580513
Description 5.00mm (.197) Pitch Appli-Mate RAST 5 Header, Vertical, 3 Circuits, Reference K09

File Size 1,144.96K  /  9 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

    51336-0210 0513360210

http://
Molex Electronics Ltd.
Part No. 51336-0210 0513360210
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 2(.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 2
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 2(.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 2

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54102-S0513B03LF
Description BERGSTIK 0.100\\ HEADER-REPLACMNT 77313-801-26LF
Tech specs    

Official Product Page

    51336-0410 0513360410

Molex Electronics Ltd.
Part No. 51336-0410 0513360410
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 4Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For TDL3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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