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  90143-0022 Datasheet PDF File

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    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70104-0022

Molex Electronics Ltd.
Part No. 70104-0022
Description 2.54mm (.100") Pitch, SL Single Row Wire-to-Wire Panel Mount, 23 Circuits
2.54mm (.100) Pitch, SL Single Row Wire-to-Wire Panel Mount, 23 Circuits

File Size 144.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    LLCC-S0022

OPLINK Communications Inc.
Part No. LLCC-S0022
Description Green Low Loss CWDM

File Size 217.47K  /  2 Page

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Amphenol Communications Solutions

Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs    

Official Product Page

    70400-0022

Molex Electronics Ltd.
Part No. 70400-0022
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version A, Nonpolarized, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb),23 Circuits

File Size 148.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90142-0022

Molex Electronics Ltd.
Part No. 90142-0022
Description 2.54mm Pitch C-Grid III?/a> Crimp Housing Dual Row, 22 Circuits

File Size 27.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    A-70280-0022

Molex Electronics Ltd.
Part No. A-70280-0022
Description 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

File Size 421.82K  /  4 Page

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Amphenol Communications Solutions

Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs    

Official Product Page

    36648-0022

Molex Electronics Ltd.
Part No. 36648-0022
Description    2.13mm Diameter MLX Pin and Socket Receptacle, 2 Circuit, Black

File Size 36.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 10127820-0222LLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing.
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10127820-0221GLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 68002-214HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70545-0022

Molex Electronics Ltd.
Part No. 70545-0022
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 23 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 23 Circuits, Tin (Sn) Plating

File Size 252.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021122-00022T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 22 contacts.
Tech specs    

Official Product Page

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