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  90136-1110 Datasheet PDF File

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    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2303 0901362303

Molex Electronics Ltd.
Part No. 90136-2303 0901362303
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361315 90136-1315

Molex Electronics Ltd.
Part No. 0901361315 90136-1315
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2307 0901362307

Molex Electronics Ltd.
Part No. 90136-2307 0901362307
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 10130611-101LF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 4-Pair, 8 column, 112 position, Right Angle Receptacle, No Guide Pin.
Tech specs    

Official Product Page

    0901361312 90136-1312

Molex Electronics Ltd.
Part No. 0901361312 90136-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-102T12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0901361307 90136-1307

Molex Electronics Ltd.
Part No. 0901361307 90136-1307
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131318-2211100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0901361306 90136-1306

Molex Electronics Ltd.
Part No. 0901361306 90136-1306
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 10131318-0811100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0901361305 90136-1305

Molex Electronics Ltd.
Part No. 0901361305 90136-1305
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131319-1411100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0901361402-17

Molex Electronics Ltd.
Part No. 0901361402-17
Description C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, Flash 0.10μm Gold (Au) Selective Plating

File Size 20.57K  /  2 Page

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Amphenol Communications Solutions

Part No. G832MB111003222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 100ΩPositions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    0901361304 90136-1304

Molex Electronics Ltd.
Part No. 0901361304 90136-1304
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 63411-102LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

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