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  87759-1850 Datasheet PDF File

For 87759-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-7633

Molex Electronics Ltd.
Part No. 87759-7633
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.89K  /  6 Page

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Texas Instruments

Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3276

Molex Electronics Ltd.
Part No. 87759-3276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Texas Instruments

Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Texas Instruments

Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.97K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-409481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-809241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4074

Molex Electronics Ltd.
Part No. 87759-4074
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 420.21K  /  8 Page

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Amphenol Communications Solutions

Part No. 10110818-5045LF
Description SFP+ Cable Assembly, 24 AWG, 4.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 10110818-5095LF
Description SFP+ Cable Assembly, 24 AWG, 9.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    87759-4064

Molex Electronics Ltd.
Part No. 87759-4064
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 10110818-5050HFLF
Description SFP+ Cable Assembly, 24 AWG, 5.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110161850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87759-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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