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  70247-1052 Datasheet PDF File

For 70247-1052 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    70247-0852 0702470852

Molex Electronics Ltd.
Part No. 70247-0852 0702470852
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Texas Instruments

Part No. TLV702475DBVR
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70247-1051 0702471051

Molex Electronics Ltd.
Part No. 70247-1051 0702471051
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Texas Instruments

Part No. TLV702475DBVT
Description 300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
Tech specs    

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Official Product Page

    70247-3452 0702473452

Molex Electronics Ltd.
Part No. 70247-3452 0702473452
Description 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 10086891-052TSRLF
Description DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Reverse Type, 0.60mm (0.024in) Pitch
Tech specs    

Official Product Page

    744770247W

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 744770247W
Description Spezifikation für Freigabe / specification for release

File Size 215.90K  /  3 Page

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Amphenol Communications Solutions

Part No. 10086891-052ASLF
Description DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Reverse Type, 0.60mm (0.024in) Pitch
Tech specs    

Official Product Page

    70247-4451 0702474451

Molex Electronics Ltd.
Part No. 70247-4451 0702474451
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 10076801-105-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    70247-6052 0702476052

Molex Electronics Ltd.
Part No. 70247-6052 0702476052
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105240900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    70247-6051 0702476051

Molex Electronics Ltd.
Part No. 70247-6051 0702476051
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-105260950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0702474054 70247-4054

Molex Electronics Ltd.
Part No. 0702474054 70247-4054
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,40 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119110-526003LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0702474051 70247-4051

Molex Electronics Ltd.
Part No. 0702474051 70247-4051
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-105220950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0702474052 70247-4052

Molex Electronics Ltd.
Part No. 0702474052 70247-4052
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 54776-105-26LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 70247-1052 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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