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Amphenol Communications Solutions |
| Part No. |
68031-415HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-424HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-433HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Bourns, Inc.
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| Part No. |
EHA4-2512/883B EHA9-2512/883B EHA9-2502/883B EHA4-2502/883B
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| Description |
Dual Micropower, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: Full-Range Ind; Package: 15-QSOP T&R
Voltage-Feedback Operational Amplifier
Ambient Light Photo Detect IC; Temperature Range: -40°C to 85°C; Package: 5-DFN
Dual Channel Micro-power, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: -40°C to 85°C; Package: 16-QSOP T&R
Dual Channel Micro-power, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: -40°C to 85°C; Package: 16-QSOP T&R 电压反馈运算放大
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| File Size |
1,069.45K /
15 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68031-420HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Molex, Inc.
MOLEX INC
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| Part No. |
19221-0316 19221-0314 19221-0342 19221-0317 19221-0335 19221-0304 19221-0307 19221-0301
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| Description |
Ring Tongue Terminal; Wire Size (AWG):6; Stud Size:1/4 COPPER ALLOY, TIN FINISH, WIRE TERMINAL
Ring Tongue Terminal; Wire Size (AWG):500 MCM; Stud Size:1/2 COPPER ALLOY, TIN FINISH, WIRE TERMINAL
Ring Tongue Terminal; Wire Size (AWG):400 MCM; Stud Size:1/2 COPPER ALLOY, WIRE TERMINAL
Ring Tongue Terminal; Wire Size (AWG):4; Stud Size:1/4 COPPER ALLOY, TIN FINISH, WIRE TERMINAL
Ring Tongue Terminal; Wire Size (AWG):1; Stud Size:5/16 COPPER ALLOY, WIRE TERMINAL
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| File Size |
70.88K /
1 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91900-31441LF
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| Description |
Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 41 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86503-148HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127403-14H1400LF
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| Description |
PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 10HP+12S Vertical Through Hole
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-411HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10112690-F03-14ULF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Surface Mount - Double row - 28 Positions - 2mm (0.079inch) - Horizontal
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Official Product Page
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Bom2Buy.com
Price and Availability
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