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  43045-2419 Datasheet PDF File

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    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1201

Molex Electronics Ltd.
Part No. 43045-1201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1200

Molex Electronics Ltd.
Part No. 43045-1200
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-419HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1206

Molex Electronics Ltd.
Part No. 43045-1206
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-124-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0613

Molex Electronics Ltd.
Part No. 43045-0613
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-424-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 68422-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs 　 　

Official Product Page

    43045-0601

Molex Electronics Ltd.
Part No. 43045-0601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 93992-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-124-19LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-0826

Molex Electronics Ltd.
Part No. 43045-0826
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-424-19LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-1624

Molex Electronics Ltd.
Part No. 43045-1624
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-419221150LF
Description BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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